게시판 > 반도체장비 1 페이지

1. Raw material : PC, MS, PMMA
2. LGP size: 60~360mm , [200~550mm}
3. LGP Thickness : 0.30~2.00mm
4. Tack time: 11 Sec(Base on 360mm)
5. Main feature : Dual working stage for serration
6. Foot print : L:1,900mm x W: 1,600mm x H: 2,060mm

Inline system / Serration-Auto Peel off-Roll Stamping

1. Application LGP Size : 5~15.6“ , [42"~86“]
2. Raw material : MS, PMMA
3. LGP Thickness : 0.2~1.5mm , [1.2~3.0mm]
4. Tack time : 7 Sec , [15sec]
5. Stock & Auto Loading System
6. Gross weight : 6Ton , [12ton]